Thermal Analysis

Everybody wants their device to be smaller and lighter with more functionality. As casework shrinks and electronics get more powerful thermal issues inevitably become a problem. How do you know how much heat is too much, and what can you do about it?

In other cases we may be designing lighting or heating devices which need to meet certain thermal performance requirements. Benchmarking and running thermal analysis to explore conceptual approaches helps narrow in on solutions early.

In one case we used advanced thermal analysis to help us predict if various recessed lighting concepts would provide the level of fire protection required by code. This was a particularly challenging case where the thermal protection requirements were in direct conflict with product cost targets. Unfortunately for our client, our thermal analysis showed that we could not get to the performance level required at the desired cost. The good news is that through effective thermal analysis we were able to come to that conclusion without spending months and tens of thousands of dollars.

More generally, steady state thermal finite element analysis can show us how thermal energy gets distributed within a design. If certain key components are above their temperature limits, perhaps they can be moved farther from the generating components. Frequently the thermal energy can be spread out to lower the maximum temperatures.

Sometimes thermally conductive materials can be used to transform some or all of your casework into a heat sink. All of these options can be simulated using the thermal analysis components of Pro/Mechanica. This prevents you from having to waste a prototype because it turns out that your electronics overheat.

Many years ago, during one of our first complex thermal analysis projects, we had to figure out how to dissipate 10 watts of heat generated by components in an IP-67 rated enclosure. The heat generation inside the device was significant but since the product was used in race cars, outside wasn’t much better. Our thermal analysis had to assume that the ambient temperature was 150 degrees F.

The team used finite element thermal modeling to define opportunities to improve heat transfer through the casework. Fortunately the top housing was cast aluminum but our thermal analysis told us that external fins would not be sufficient. There were 12 separate electrical components of different sizes and shapes that generate the majority of the heat. Heat sinking them individually to the casting was prohibitively expensive. Continued thermal analysis and consultation with suppliers drove us to a workable solution relatively quickly. We integrated a form in place thermally conductive elastomer which our simulations suggested would move the heat effectively from the hot components to the inside wall of the housing.

Potential thermal issues are identified up front through effective and timely thermal analysis, because getting the heat out of an assembly that has already been designed can be very difficult if not impossible.

At Bresslergroup potential thermal issues are identified up front, because getting the heat out of an assembly that has already been designed can be very difficult if not impossible.

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